Slurry
CMP Process
After going through the semiconductor processing stages, pattern irregularities occur on the wafer.
CMP (Chemical Mechanical Polishing) is a process that uses both chemical and physical actions to reduce irregularities and remove unnecessary films.
Slurry Supply Equipment
The slurry supply equipment includes an LPC installed at the rear of the final supply tank filter.
This feature helps to prevent process accidents such as micro S/C and wafer defects in advance.
LPC
Accusizer MiniLE
Monitors oxide, metal slurry, and other substances in real-time
Accusizer MiniFX
Monitors oxide, ceria, metal slurry, and other substances in real-time
Accusizer MiniFX-Nano
Monitors colloidal ceria, metal slurry, and other substances in real-time
Sigma Series
Auto-validate and self-clean of LPC
Chemical Concentration Monitor
APMi
Monitors the concentration of H2O2 added in trace amounts to metal slurry in real-time