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CMP Process

After going through the semiconductor processing stages, pattern irregularities occur on the wafer.
CMP (Chemical Mechanical Polishing) is a process that uses both chemical and physical actions to reduce irregularities and remove unnecessary films.

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Slurry Supply Equipment

The slurry supply equipment includes an LPC installed at the rear of the final supply tank filter.
This feature helps to prevent process accidents such as micro S/C and wafer defects in advance.

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LPC

Accusizer MiniLE

Monitors oxide, metal slurry, and other substances in real-time

Accusizer MiniFX

Monitors oxide, ceria, metal slurry, and other substances in real-time

Accusizer MiniFX-Nano

Monitors colloidal ceria, metal slurry, and other substances in real-time

Sigma Series

Auto-validate and self-clean of LPC

Chemical Concentration Monitor

APMi

Monitors the concentration of H2O2 added in trace amounts to metal slurry in real-time

Join ATIK, who strives for various innovations for the customers.

Join ATIK, who strives for various innovations for the customers.

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